Kombinierte Bewertung von Interconnect und Entzerrung für Datenverbindungen auf mehrlagigen Leiterplatten

Project Title
Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards
Principal Investigator
Project Abstract
Increasing data rates and reduced design margins oppose a detailed consideration of the diverse aspects of high-speed digital links, such as the passive channel, equalization, and coding. This work offers novel methods for the computationally efficient design and validation of links. A combined system perspective is established based on predominant physical parameters of the interconnect and key parameters of equalizer design. This enables a systematic prediction of design constraints and is accompanied by a study of advanced uncertainty quantification methods for pre- and post-layout design.