Analyse elektromagnetischer Interferenzen in Server-Gehäusen


Project Title
Analysis of Electromagnetic Interference in Server Casings
 
 
Principal Investigator
 
Co-Worker
 
 
Status
Abgeschlossen
 
Duration
01-04-2011
-
08-04-2016
 
Project Abstract
With increasing data rates EM emission has become a major issue for EMC and EMI considerations in current server designs. Major sources of EM emission inside include ICs, cables and connectors, and Printed Circuit Boards. While efficient techniques exist to model the interior coupling of PCB cavities (Zpp ), the external (3D) coupling still has to be computed using full-wave techniques.

This project aims to combine the different methods to model and simulate the components of the server. The dimensions and high data rates in addition to the high complexity of the individual components encountered in modern servers lead to a number of unknowns that are commonly in the range of several million. Therefore, efficient numerical methods and approximate models have to be developed.