Analyse elektromagnetischer Interferenzen in Server-Gehäusen

Project Title
Analysis of Electromagnetic Interference in Server Casings
Principal Investigator
Project Abstract
With increasing data rates EM emission has become a major issue for EMC and EMI considerations in current server designs. Major sources of EM emission inside include ICs, cables and connectors, and Printed Circuit Boards. While efficient techniques exist to model the interior coupling of PCB cavities (Zpp ), the external (3D) coupling still has to be computed using full-wave techniques.

This project aims to combine the different methods to model and simulate the components of the server. The dimensions and high data rates in addition to the high complexity of the individual components encountered in modern servers lead to a number of unknowns that are commonly in the range of several million. Therefore, efficient numerical methods and approximate models have to be developed.