Entwurf passiver Mikrowellen-Komponentnen auf Multilagen-Leiterplatten mit Hilfe funktionaler Vias


Project Title
Design of Passive Microwave Components on Multilayered Printed Circuit Boards Using Functional Vias
 
 
Principal Investigator
 
Co-Worker
 
 
Status
Abgeschlossen
 
Duration
01-01-2011
-
30-06-2015
 
 
Project Abstract
This thesis deals with the design of passive microwave components such as filters, couplers and matching networks using functional vias (plated through holes) on multilayered printed circuit boards. For this purpose, the otherwise parasitic wave effects associated with vias are carefully analyzed and used functionally. The design of the components was performed on theoretical and simulation level. Scattering parameters measurements up to 35 GHz are used for validation purposes. The designs are compared to common microwave components based on microstriplines. Advantages and disadvantages with regard to electric performance and area requirements are discussed.
 

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