On the upper bound of total uncorrelated crosstalk in large through silicon via arrays

Start Page
1
End Page
4
Article Number
7496309
Citation
2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings : 7496309, 1-4 (2016-06-20)
Contribution to Conference
IEEE 20th Workshop on Signal and Power Integrity, SPI 2016  
Publisher DOI
10.1109/SaPIW.2016.7496309
Scopus ID
2-s2.0-84980319717
Large via arrays contribute substantially to the coupling path of crosstalk between channels of interconnects. In principle, in order to design robust interconnects, the crosstalk contributions from all aggressor channels must be quantified and adequately superposed to represent the crosstalk mechanism. If the modeling is based on frequency domain electromagnetic simulations, in general, it is necessary to simulate the complete geometry for a large number of frequencies in order to accurately represent the physical effects. In this paper, an efficient statistical frequency domain superposition of crosstalk is proposed and validated against time domain methods. The proposed approach provides a measure of total crosstalk by assuming uncorrelated signals on different channels. Using this definition, it can be reasoned whether an upper bound of total uncorrelated crosstalk exists and which vias should be included in a meaningful approximation of a large array.
Subjects
crosstalk
link simulation
via arrays
DDC Class
600: Technik