Please use this identifier to cite or link to this item: https://doi.org/10.15480/882.1906
This item is licensed with a CreativeCommons licence by-nc-nd/4.0
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dc.contributor.authorDaniel, Christian-
dc.contributor.authorManderla, Jannik-
dc.contributor.authorHallmann, Sina-
dc.contributor.authorEmmelmann, Claus-
dc.date.accessioned2018-12-06T06:02:47Z-
dc.date.available2018-12-06T06:02:47Z-
dc.date.issued2016-
dc.identifier.citationPhysics Procedia (83): 135-146 (2016-01-01)de_DE
dc.identifier.issn1875-3892de_DE
dc.identifier.urihttp://tubdok.tub.tuhh.de/handle/11420/1909-
dc.description.abstractInnovative chip breakers for cutting tools made of very hard materials require laser ablation and demand a high quality regarding the manufactured surface. When processing materials such as polycrystalline cubic boron-nitride or tungsten carbide the surface roughness by laser ablation reaches Sa= 1,0-2,9 μm compared to Sa= 0,42 μm achieved by grinding. Therefore in the presented research the influence of the hatching exposure strategy on surface roughness during picosecond laser ablation of tungsten carbide is examined. The areal, layerwise ablation process is separated into its elements which are represented by intersection zones between single and multiple laser vectors. Thus two mechanisms of roughness formation are identified and described by model functions. Further the mechanisms are transferred to areal ablation in which surface roughness decreases due to improved hatching angles compared to a commonly used one of φ= 0°/90°. With this approach the roughness is reduced by approximately factor 2,0-3,5 to Sa= 0,82 μm. In conclusion guidelines are derived which present favorable settings for high quality laser ablation processes.en
dc.language.isoende_DE
dc.publisherElsevierde_DE
dc.relation.ispartofPhysics procediade_DE
dc.rightsinfo:eu-repo/semantics/openAccess-
dc.subjectpicosecond laser ablationde_DE
dc.subjecthatching anglede_DE
dc.subjectsurface roughnessde_DE
dc.subjecthard materialsde_DE
dc.subjecttungsten carbidede_DE
dc.subject.ddc600: Technikde_DE
dc.titleInfluence of an angular hatching exposure strategy on the surface roughness during picosecond laser ablation of hard materialsde_DE
dc.typeArticlede_DE
dc.identifier.urnurn:nbn:de:gbv:830-882.024354-
dc.identifier.doi10.15480/882.1906-
dc.type.diniarticle-
dc.subject.ddccode600-
dcterms.DCMITypeText-
tuhh.identifier.urnurn:nbn:de:gbv:830-882.024354de_DE
tuhh.oai.showtrue-
dc.identifier.hdl11420/1909-
tuhh.abstract.englishInnovative chip breakers for cutting tools made of very hard materials require laser ablation and demand a high quality regarding the manufactured surface. When processing materials such as polycrystalline cubic boron-nitride or tungsten carbide the surface roughness by laser ablation reaches Sa= 1,0-2,9 μm compared to Sa= 0,42 μm achieved by grinding. Therefore in the presented research the influence of the hatching exposure strategy on surface roughness during picosecond laser ablation of tungsten carbide is examined. The areal, layerwise ablation process is separated into its elements which are represented by intersection zones between single and multiple laser vectors. Thus two mechanisms of roughness formation are identified and described by model functions. Further the mechanisms are transferred to areal ablation in which surface roughness decreases due to improved hatching angles compared to a commonly used one of φ= 0°/90°. With this approach the roughness is reduced by approximately factor 2,0-3,5 to Sa= 0,82 μm. In conclusion guidelines are derived which present favorable settings for high quality laser ablation processes.de_DE
tuhh.publisher.doi10.1016/j.phpro.2016.08.026-
tuhh.publication.instituteLaser- und Anlagensystemtechnik G-2de_DE
tuhh.identifier.doi10.15480/882.1906-
tuhh.type.opus(wissenschaftlicher) Artikelde
tuhh.institute.germanLaser- und Anlagensystemtechnik G-2de
tuhh.institute.englishLaser- und Anlagensystemtechnik G-2de_DE
tuhh.gvk.hasppnfalse-
openaire.rightsinfo:eu-repo/semantics/openAccessde_DE
dc.type.driverarticle-
dc.rights.ccby-nc-ndde_DE
dc.rights.ccversion4.0de_DE
dc.type.casraiJournal Articleen
tuhh.container.volume83de_DE
tuhh.container.startpage135de_DE
tuhh.container.endpage146de_DE
dc.relation.conference9th International Conference on Photonic Technologies - LANE 2016de_DE
dc.rights.nationallicensefalsede_DE
item.fulltextWith Fulltext-
item.creatorOrcidDaniel, Christian-
item.creatorOrcidManderla, Jannik-
item.creatorOrcidHallmann, Sina-
item.creatorOrcidEmmelmann, Claus-
item.creatorGNDDaniel, Christian-
item.creatorGNDManderla, Jannik-
item.creatorGNDHallmann, Sina-
item.creatorGNDEmmelmann, Claus-
item.grantfulltextopen-
crisitem.author.deptLaser- und Anlagensystemtechnik G-2-
crisitem.author.deptLaser- und Anlagensystemtechnik G-2-
crisitem.author.deptLaser- und Anlagensystemtechnik G-2-
crisitem.author.deptLaser- und Anlagensystemtechnik G-2-
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