|Publisher DOI:||10.1109/ESTC.2006.280149||Title:||Lean manufacturing of RFID products - Put the chip on the box!||Language:||English||Authors:||God, Ralf||Issue Date:||1-Dec-2007||Source:||ESTC 2006 - 1st Electronics Systemintegration Technology Conference (2): 4060874 (2007-12-01)||Journal or Series Name:||Electronics Systemintegration Technology Conference 2007||Abstract (english):||Radio Frequency Identification (RFID) is an emerging technology to be used in volume for the identification and tracking of goods. For contactless communication with pallets, boxes and individual items an RFID label is applied onto the goods. The need for that kind of smart labels is estimated to be one billion in 2006 with an intense upward trend during the next decade. Due to an intended one-way use the cost target for a smart label currently is five US cents. To achieve this ambitious goal the development of novel manufacturing strategies for RFID products is of major importance. © 2006 IEEE.||URI:||http://hdl.handle.net/11420/3119||ISBN:||978-142440552-7||Institute:||Flugzeug-Kabinensysteme M-25||Type:||InProceedings (Aufsatz / Paper einer Konferenz etc.)|
|Appears in Collections:||Publications without fulltext|
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