Application of the FINEPLACER® lambda 2
The lambda 2 is designed to position fine pitch devices e. g. Flip Chips and Flip Chip assemblies, optoelectronic components, micro electro mechanic systems (MEMS), micro optoelectronic mechanic systems (MOEMS), sensors, micro optics, TAB, bare chips and other high-count surface mounted devices (SMD). The FINEPLACER® System is based on a unique placement principle integrated into five machine models according to the type and sizes of the various components and substrate dimensions. Using the highly accurate Vision Alignment System (VAS), the FINEPLACER® lambda
2 is designed to accurately place the component on the first attempt. As its accuracy is 0.5 μm, it is possible to position new technology components with very fine pitch uniformly and accurately.
Optional accessories include special optics for positioning large fine pitch devices on their substrates and high magnification systems for observing chip bonding. All state of the art bonding technologies can be performed, such as thermocompression, ultrasonic/thermosonic bonding, ACF bonding, UV cure and bonding of C4 chips. Due to the modular system, the necessary configuration may easily be optimized, corresponding to your individual requirements. As every FINEPLACER®, the lambda allows cost effective and safe manual component placement and bonding at one
work station and in the same operation.