Hassab, YoucefYoucefHassabSchierholz, Christian MortenChristian MortenSchierholzBohl, LennartLennartBohlEsmaeili, HamidehHamidehEsmaeiliHillebrecht, TilTilHillebrechtYang, ChengChengYangHeßling, JanJanHeßlingSchuster, ChristianChristianSchuster2026-01-082026-01-082025-12-24IEEE Electromagnetic Compatibility Magazine 14 (4): 69-80 (2025)https://hdl.handle.net/11420/60707Machine learning (ML) has gained traction and emerged as one of most researched topics in recent years. Many engineering disciplines are taking advantage of a multitude of developed ML tools to enhance the engineering workflow, solve complicated problems or speedup design processes. This paper presents an overview on past and present developments of ML-based modeling and design in the field of electromagnetic compatibility (EMC) and the related fields of signal integrity (SI), power integrity (PI), bioelectromagnetics (BioEM) and electromagnetic field (EMF) scans. A critical analysis of recent research on ML applications is carried out to identify the arising opportunities and challenges facing the wide adoption of ML for the modeling and design in EMC. Based on current trends, a vision for ML-based modeling and design in EMC is presented in an attempt to foresee the direction of near-future research. A set of recommendations is formulated to tackle actual challenges facing a wider adoption. ML integration in EMC engineering has a great potential to revolutionize the modeling and design processes, despite the open challenges and the rising complexities of the faced problems.en2162-2264IEEE electromagnetic compatibility magazine202546980Institute of Electrical and Electronics Engineersbioelectromagnetics (BioEM)Data-Drivenelectromagnetic compatibility (EMC)electromagnetic field (EMF) scansMachine Learningpower integrity (PI)signal integrity (SI)Technology::621: Applied Physics::621.3: Electrical Engineering, Electronic EngineeringDevelopments in machine learning based modeling and design for electromagnetic compatibilityJournal Article10.1109/MEMC.2025.11314902Journal Article