Heyen, JohannJohannHeyenJacob, Arne F.Arne F.Jacob2021-12-072021-12-072005-1035th European Microwave Conference 2005 - Conference Proceedings 3 (): 1610235 1499-1502 (2005)http://hdl.handle.net/11420/11172In this paper anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabilities is presented.In this paper anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabilities is presented.enTechnikIngenieurwissenschaftenConference Paper10.1109/EUMC.2005.1610235https://tore.tuhh.de/handle/11420/11172Other