Optical Profilometer Dataset for Diced Surfaces Obtained with Wafer Dicing Machine at Varying Feed Velocities

Rennpferdt, LukasLukasRennpferdtBohne, SvenSvenBohneTrieu, Hoc KhiemHoc KhiemTrieu2026-01-292026-01-292026-01-29https://hdl.handle.net/11420/56953Fused silica wafers (1mm thickness) were diced with a wafer dicing machine (Disco DAD3350) at different feed velocities to analyze the impact on the surface roughness. The surface roughness was measured with an optical profilometer (Keyence VK-X3000) in white light interferometer mode. Raw data from the interferometer measurements and a README file are included in this dataset.enhttps://creativecommons.org/publicdomain/mark/1.0/Wafer DicingOptical ProfilometerSurface RoughnessTechnology::620: Engineering::620.1: Engineering Mechanics and Materials ScienceOptical Profilometer Dataset for Diced Surfaces Obtained with Wafer Dicing Machine at Varying Feed VelocitiesMeasurement and Test Datahttps://doi.org/10.15480/882.1576310.15480/882.15763Rennpferdt, LukasLukasRennpferdtRennpferdt, LukasLukasRennpferdt