Chip form monitoring in turning internal surfaces with acoustic emission using thin film sensors

Nedeß, ChristianChristianNedeßPflueg, ChristianChristianPflueg2025-07-282025-07-2819947th International Conference on Production/Precision Engineering, ICPE 1994https://hdl.handle.net/11420/56459Technology::600: TechnologyChip form monitoring in turning internal surfaces with acoustic emission using thin film sensorsConference PaperConference Paper