Yildiz, Ömer FarukÖmer FarukYildizThomsen, OleOleThomsenBochard, MarcMarcBochardYang, ChengChengYangSchuster, ChristianChristianSchuster2021-03-082021-03-082021-0150th European Microwave Conference (EuMC 2020)http://hdl.handle.net/11420/9055A novel approach to filter design including proof of concept is demonstrated through the first-time vertical integration of Chebyshev lowpass- and bandpass-filters in low temperature cofired ceramic (LTCC) multilayered substrates. Integration is achieved by replacing planar stub elements by resonant vertical interconnect accesses (vias) which serve the functional purpose of a vertical transmission line and therefor add another full degree of freedom in circuit design. The filters shown are comprised of two lowpass filters of 3rd- and 5th-order, and one bandpass filter of 5th-order. The general description of the design is given together with full filter specifications. Full-wave simulations based on the finite element method (FEM) and measurement results are compared to each other and are in excellent agreement.enbandpass filterlow temperature cofired ceramicslowpass filtermultilayered substratevertical integrationviasConference Paper10.23919/EuMC48046.2021.9338027Other