Yang, MingzhuMingzhuYangZhang, HaixiaHaixiaZhangDeng, QiboQiboDeng2019-11-272019-11-272017-08-01Electrochemistry Communications (82): 125-128 (2017-09-01)http://hdl.handle.net/11420/3899Copper underpotential deposition (UPD) on a gold surface is investigated by cyclic voltammetry coupled with in situ cyclic strain to understand the strain-modulated electrodeposition. Our work emphasizes quantification of an electrocapillary coupling coefficient ς, which relates the response of Cu electrodeposition potential, E, to applied strain, ε. The different responses to the strain are observed at two Cu UPD stages. The data indicate that tensile strain could enhance the formation of a Cu monolayer on the Au surface. The typical electrodeposition process could be modulated by an external mechanical strain.en1388-24812017125128Elsevier ScienceCopper electrodepositionElectrocapillary couplingMetal-electrolyte interfaceStrain modulationPhysikTechnikJournal Article10.1016/j.elecom.2017.07.029Other