Duan, XiaominXiaominDuanDahl, DavidDavidDahlSchuster, ChristianChristianSchusterNdip, Ivan N.Ivan N.NdipLang, Klaus-DieterKlaus-DieterLang2020-09-012020-09-012015-09-02IEEE Workshop on Signal and Power Integrity, SPI: 7237387 (2015-09-02)http://hdl.handle.net/11420/7203A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.encylindrical wave functionmultipole expansion methodThrough-silicon-viaEfficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion methodConference Paper10.1109/SaPIW.2015.7237387Other