Albertsen, BjörnBjörnAlbertsenSpeerforck, ArneArneSpeerforck2022-11-032022-11-032022-0719th International Refrigeration and Air Conditioning Conference at Purdue: 2375 (2022)http://hdl.handle.net/11420/13939In this study, a twophase loop thermosiphon cooling system is coupled with latent heat storages integrated in the evaporator and investigated experimentally. A test rig using the lowGWP refrigerant R1233zd(E) is set up with a maximum power of 1.3 kW (23.2 W cm-1), supplied by a dummy for the electronic component to be cooled. Dynamic application scenarios are divided into two general categories and examined using respective examples. The results show high potential for changes in the heat sink temperature, whereas varying heat loads are more challenging regarding design and dimensioning of the PCMevaporatorcomposites. In both cases, significant improvements can be achieved in terms of temperatures and uncritical operation time.enTwo-phase Loop Thermosiphon Coupled With Latent Heat Storage For Electronics CoolingConference Paperhttps://docs.lib.purdue.edu/iracc/2375Purdue UniversityOther