Rennpferdt, LukasLukasRennpferdtBohne, SvenSvenBohneTrieu, Hoc KhiemHoc KhiemTrieu2024-03-122024-03-122023-10-23Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023. - Berlin, 2023.978-3-8007-6203-3978-3-8007-6204-0https://hdl.handle.net/11420/46380Micro-Electro-Mechanical-Systems (MEMS) are nowadays indispensable and typically fabricated using semiconductor technology methods. As the systems are getting more complex, methods for 3D patterning in MEMS become more relevant and useful. At the same time, established methods from 3D printing getting more precise and gaining ground in the fabrication of MEMS. Within this work, an approach for an extended toolbox is presented, which integrates the often one-step processes of 3D patterning into thetypically iterative process flows composed of the traditional semiconductor technology methods and thus improves the capabilities for the fabrication of 3D MEMS. For this, methods of 3D printing and 3D patterning in-volume and on surface are investigated with regard to compatibility with methods of the traditional semiconductor technology.enTechnologyElectrical Engineering, Electronic EngineeringConference PaperConference Paper