Friesicke, ChristianChristianFriesickeRohrdantz, BenjaminBenjaminRohrdantzStark, AlexanderAlexanderStarkJacob, ArneArneJacob2021-01-082021-01-082014-11Asia-Pacific Microwave Conference (APMC 2014)http://hdl.handle.net/11420/8346A vertical interconnect for densely packed active antenna array front-ends between K- and V-band is studied in this paper. The interconnect provides DC-blocking, which is useful for hybrid integration of switched or active components within a vertical module stack. The DC-blocking functionality is implemented using the solder mask film commonly available in low-cost PCB fabrication processes. The design is robust against lateral misalignment and compatible with a wide range of solder mask dielectrics. The measured performance shows good matching between 20 GHz and 50 GHz, which makes the design attractive for current and emerging satellite communication bands.enActive antennasHybrid integrated circuit interconnectionsSatellite communicationConference PaperOther