2023-06-252023-06-25https://tore.tuhh.de/handle/11420/24661Piero Triverio received the M.Sc. and Ph.D. degrees in Electronic Engineering from Politecnico di Torino, Italy in 2005 and 2009, respectively. He is an Associate Professor with the Department of Electrical and Computer Engineering at the University of Toronto, where he holds the Canada Research Chair in Modeling of Electrical Interconnects. From 2009 to 2011, he was a research assistant with the Electromagnetic Compatibility group at Politecnico di Torino, Italy. He has been a visiting researcher at Carleton University in Ottawa, Canada, and at the Massachusetts Institute of Technology in Boston. His research interests include signal integrity, computational electromagnetics, model order reduction, and computational fluid dynamics applied to cardiovascular diseases. He received several international awards, including the 2007 Best Paper Award of the IEEE Transactions on Advanced Packaging, the EuMIC Young Engineer Prize at the 13th European Microwave Week, and the Best Paper Award at the IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2008).