Herwig, HeinzHeinzHerwig2022-03-162022-03-162011ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2011 Vol. 1 (): 451-454 (2011)http://hdl.handle.net/11420/12010The often used argument that heat transfer in micro-sized devices is superior due to the fact that the transfer area scales like L2 but the volume like L3 with L as a characteristic length is critically analyzed for various heat transfer situations. It turns out that for steady state heat transfer cases the thermal boundary layer behavior is more important. In general, dimensional analysis should be applied to understand how the heat transfer performance changes when scales are reduced from macro-to micro-size. Copyright © 2011 by ASME.enHeat transferDimensional analysisSteady stateThermal boundary layersPhysikConference Paper10.1115/ICNMM2011-58016Other