Scharff, KatharinaKatharinaScharffBrüns, Heinz-DietrichHeinz-DietrichBrünsSchuster, ChristianChristianSchuster2020-01-092020-01-092019-12IEEE Transactions on Electromagnetic Compatibility 6 (61): 1849-1859 (2019-12)http://hdl.handle.net/11420/4321With bitrates increasing beyond 50 Gb/s, new challenges arise for the electrical modeling and evaluation of printed circuit boards (PCBs). In this work, an efficient modeling technique for the analysis of differential far-end crosstalk in a typical PCB link up to 100 GHz is proposed. The crosstalk of an interconnect is analyzed by separating the link into different subcomponents that include two via arrays and the striplines connecting them. By validating with full-wave simulations, it is shown for this frequency range that the physics-based via modeling approach in conjunction with a quasistatic two-dimensional transmission line model is an accurate and fast modeling approach, thus enabling a quick design analysis of PCB links. Based on a simultaneous variation of all the relevant geometrical parameters, with a total of about 59 000 model variations, the dependencies of differential far-end crosstalk on the link geometry are explored. Among other conclusions, it is found that the large variance in crosstalk is not dominated exclusively by a single parameter.en0018-93752019618491859Allgemeines, WissenschaftJournal Article10.1109/TEMC.2019.2894536Other