Metz, CarstenCarstenMetzBaras, TorbenTorbenBarasLyons, AlanAlanLyons2021-12-092021-12-092005-06IEEE MTT-S International Microwave Symposium (2005)http://hdl.handle.net/11420/11239In this paper two novel transmission line architectures for intra-layer transitions in multilayer printed circuit boards (PCBs) are presented. Based on a balanced power divider and combiner concept, these can significantly improve the broadband transmission behavior for transmission rates beyond 10GB/s. The electrical performance for state-of-the-art PCBs is reviewed, and compared to the novel approach by means of simulations and measurements.en0149-645xIEEE MTT-S International Microwave Symposium digest2005853856CombinerDividerMultilayer circuit boardsStub resonanceViasBroadband dual-via architectures for multilayer PCB signal injection and intra-layer transitionConference Paper10.1109/MWSYM.2005.1516752Other