2026-10-092026-10-092026-07-21https://hdl.handle.net/11420/63980CONMLS is a physics-based simulation framework for multilayer substrates enclosed by solid reference planes. It uses fast semi-analytical methods to model the vias, cavities, striplines and coaxial structures. These components are combined into a complete model of a printed circuit board using segmentation techniques. The results are S-parameters between the assigned via ports at the top and bottom planes of the stackup. This manual explains how to install CONMLS and describes all available features and the human-readable ASCII input files.enhttps://creativecommons.org/licenses/by-nc-nd/4.0/multilayer substratesvia modelingPCB simulationsignal integritypower integritycontour integral methodtransmission linesTechnology::621: Applied Physics::621.3: Electrical Engineering, Electronic EngineeringNatural Sciences and Mathematics::530: PhysicsTechnical Report10.15480/882.17543Theoretische Elektrotechnik E-18