Ranjan, RajeevRajeevRanjanJohn, BibinBibinJohnSchröder, DietmarDietmarSchröderKrautschneider, WolfgangWolfgangKrautschneider2021-01-072021-01-072016-09ANALOG 2016 - 15. ITG/GMM-Fachtagung (2016)http://hdl.handle.net/11420/8321A typical medical implant electronics consists of a sensor with additional electronic components for sensor measurement, wireless energy harvesting and wireless data transmission. The implant electronics must be as small as possible, so that it can be implanted inside the body of the patient. This paper details the design of an application-specific integrated circuit (ASIC) which integrates sensor measurement, wireless power reception and wireless data transmission in a single die. The ASIC is designed to support a capacitive pressure sensor and it is powered using inductive coupling. The sensor measurement uses a reference fixed capacitor to compensate for the baseline drift of pressure value in the implant. The ASIC is designed in a 350 nm High Voltage CMOS technology.enConference PaperOther