Talai, ArminArminTalaiWeigel, RobertRobertWeigelKölpin, AlexanderAlexanderKölpinGmeiner, BjörnBjörnGmeinerRude, UlrichUlrichRudeSteinhäußer, FrankFrankSteinhäußerBittner, AchimAchimBittnerSchmid, UlrichUlrichSchmid2020-07-082020-07-082013-10European Microwave Week (EuMC 2013)http://hdl.handle.net/11420/6675Recent investigations demonstrated that porosification offers the possibility of high quality antenna integration on LTCC by local reduction of the relative permittivity. In order to take advantage of this technology, further research for the deposition of conductors on porosified areas has to be done. Since the near-surface material removal is strong, conductors are expected to penetrate substantially into the porosified substrate. In this paper a new, randomized structural modeling technique of porosified LTCC is presented, which is based on scanning electron microscope imaging. Finite 3D field simulations, performed with this model, show the electromagnetic effects of different vertical microstrip positions on the effective permittivity and the corresponding scattering parameters.enField simulationinhomogeneous substrateLTCCporosificationreduction of permittivitystructural modelingConference PaperOther