Hardock, AndreasAndreasHardockBrüns, Heinz-DietrichHeinz-DietrichBrünsSchuster, ChristianChristianSchuster2020-06-172020-06-172015-02-10IEEE Transactions on Microwave Theory and Techniques 3 (63): 7038228 976-985 (2015-03-01)http://hdl.handle.net/11420/6343This paper presents a novel concept for microwave filter design using vias (plated through-holes) in multilayered printed circuit boards. By using the concept that vias accompanied by a sufficient number of ground vias in close proximity can be approximated as transmission lines in a certain frequency range, corresponding effective impedances and phase velocities for different configurations of vias and ground vias are deduced. By controlling these transmission-line parameters, standard microwave filter methodology is applied for the design of low-pass and bandpass Chebychev filters in the frequency range of 5-20 GHz. Measurements and full-wave simulation results are presented as validation. Advantages and limitations of the proposed method are discussed.en0018-9480IEEE transactions on microwave theory and techniques / Symposium issue20153976985IEEEFiltermicrowave componentspassive filterplated through holesprinted circuit board (PCB)viaTechnikChebyshev filter design using vias as quasi-transmission lines in printed circuit boardsJournal Article10.1109/TMTT.2015.2396892Other