Hansen, NilsNilsHansenRadzijewski, StefanStefanRadzijewskiMohncke, Jan PhilipJan PhilipMohnckeJacob, ArneArneJacob2019-11-262019-11-262017-10-04IEEE MTT-S International Microwave Symposium Digest: 8058676 (2017-10-04)http://hdl.handle.net/11420/3888Hybrid integration often requires to connecting components with different contact footprints, typical examples being MMICs versus larger drop-in devices. In microstrip technology this calls for different line widths and substrate thicknesses. This paper proposes a novel transition between two microstrip lines of different width and height. The basic concept of the multilayer approach is to gradually adapt the field distribution along the transition while keeping the impedance constant. In simulation the optimized transition exhibits an impedance match in excess of 20 dB from DC to 20 GHz. For verification a back-to-back transition is fabricated and measured. It features more than 13 dB input match and an insertion loss below 1 dB in a bandwidth up to 20 GHz, and the results being in good agreement with simulation.en0149-645x2017727729High-IntegrationLow-CostMicrostripMultilayerTransitionUltra-WidebandConference Paper10.1109/MWSYM.2017.8058676Other