Baras, TorbenTorbenBarasJacob, ArneArneJacob2021-11-022021-11-022008German Microwave Conference, GEMIC 2008 (): Seite 446-449 (2008-01-01)http://hdl.handle.net/11420/10751enTechnikIngenieurwissenschaftenThermal packaging concept for LTCC microwave power applicationsConference PaperOther