Müller, JensJensMüllerPerrone, Rubén ArielRubén ArielPerroneDrüe, Karl-HeinzKarl-HeinzDrüeStephan, RalfRalfStephanTrabert, JohannesJohannesTrabertHein, MatthiasMatthiasHeinSchwanke, DieterDieterSchwankePohlner, JürgenJürgenPohlnerReppe, GünterGünterReppeKulke, ReinhardReinhardKulkeUhlig, PeterPeterUhligJacob, ArneArneJacobBaras, TorbenTorbenBarasMolke, AlexanderAlexanderMolke2021-11-122021-11-122007Proceedings of the IMAPS/ACerS 3rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007) : April 23 - 26, 2007, Grand Hyatt Hotel, Denver, Colorado / International Microelectronics and Packaging Society (IMAPS); American Ceramic Society (ACerS). - Washington, DC, 2007. - Pp. 98-103http://hdl.handle.net/11420/10903enTechnikIngenieurwissenschaftenComparison of high resolution patterning technologies for LTCC microwave circuitsConference Paper0-930815-81-5Other