Wagner, FabianFabianWagnerElneel, Nashwa AboNashwa AboElneelSchröder, DietmarDietmarSchröderKrautschneider, WolfgangWolfgangKrautschneider2024-06-202024-06-2020103rd Electronics System Integration Technology Conference ESTC, Berlin, Germany, 2010, pp. 1-5978-1-4244-8553-6978-1-4244-8554-3https://hdl.handle.net/11420/47918A 3 channel ECG system with wireless data transmission is presented. It is built as a System in Package (SiP) consisting of 6 dies and 39 SMD components mounted on a FR4 substrate at a size of 2.45 x 2.45 mm2. Design considerations and ASIC partitioning is addressed in this work. In addition, measurement results are presented proving that a SiP can compete with a System on Chip.enTechnology::621: Applied Physics::621.3: Electrical Engineering, Electronic EngineeringConference Paper10.1109/ESTC.2010.5642857Conference Paper