Müller, JensJensMüllerPerrone, Rubén ArielRubén ArielPerroneDrüe, Karl-HeinzKarl-HeinzDrüeStephan, RalfRalfStephanTrabert, Johannes F.Johannes F.TrabertHein, MatthiasMatthiasHeinSchwanke, DieterDieterSchwankePohlner, JürgenJürgenPohlnerReppe, GünterGünterReppeKulke, ReinhardReinhardKulkeUhlig, PeterPeterUhligJacob, Arne F.Arne F.JacobBaras, TorbenTorbenBarasMolke, AlexanderAlexanderMolke2021-11-102021-11-102007-07-01Journal of Microelectronics and Electronic Packaging 4 (3): 99-104 (2007-07-01)http://hdl.handle.net/11420/10867Low-temperature co-fired ceramic (LTCC) are widely acknowledged for wide-band and microwave circuits. Within the project consortium KERAMIS, implementation of higher functionality in LTCC substrates is being investigated. Among the applications considered are a 4 × 4 switch matrix [1], voltage-controlled oscillators [2], and amplifiers for multimedia satellite communications working in Ka-band. In order to add more functionality (e.g., filters, couplers) in LTCC, current patterning limits of line width and line separation need to be extended. Four different technologies were considered for higher resolution: a) fine-line printing technology with special screens, b) photo-imageable pastes, c) etching of thick-film conductors (co- and post-fired), and d) thin films on LTCC. Evaluation of patterning technologies is based on a test coupon that was designed and manufactured by the consortium members. The artwork contains lines, line transitions, ring resonators (microstrip and stripline), edge-coupled filters, DC blocking structures, and various lines for DC resistance testing. The smallest gap definition is 50 μm. Two substrate materials, Du Pont tapes 951 and 943, are included in the study. In addition to the main frequency band of interest in the project (17-22 GHz), these structures have been characterized up to 50 GHz. Electrical results are correlated to physical measurements of the structures (line width, spaces, and tolerances) and are evaluated with respect to performance, manufacturability, and yield. Results show excellent performance for screen-printed structures and demonstrated the importance of mask tuning to achieve optimum resolution (under etching etc.). © International Microelectronics And Packaging Society - JMEP.en1551-48972007399104Allen PressLTCCMicrowaveSatellite applicationThin filmTechnikJournal Article10.4071/1551-4897-4.3.99Other