Hardock, AndreasAndreasHardockSchuster, ChristianChristianSchuster2020-09-012020-09-012015-05-13German Microwave Conference, GeMiC: 7107759 (2015-05-13)http://hdl.handle.net/11420/7208This contribution extends previous work of the authors on microwave couplers using vias (plated through holes). In [1] a novel concept for microwave coupler design using vias in multilayered printed circuit boards (PCBs) was presented. By placing thru vias inside a ground via cage, high coupling between the vias can be observed. In this work it is shown that appropriate definition of via ports leads to a filter behavior of the structure. By adjusting the dimensions of the structure and by adding further thru vias the filter behavior can be controlled. Results are validated by physics-based and full-wave simulations up to 40 GHz.enband-pass filterscoupled viasfunctional viasPCBphysics-based modelsConference Paper10.1109/GEMIC.2015.7107759Other