Hillebrecht, TilTilHillebrechtAlfert, JohannesJohannesAlfertSchuster, ChristianChristianSchusterLelekas, PantelisPantelisLelekasSismanis, NikolaosNikolaosSismanisBouzianas, GeorgiosGeorgiosBouzianas2026-07-312026-07-312026-06-1430th IEEE Workshop on Signal and Power Integrity, SPI 2026https://hdl.handle.net/11420/64179As high-speed interconnects on printed circuit boards (PCBs) advance into the beyond 400 Gbps domain, accurate characterization of vias becomes critical. Via arrays are investigated at frequencies up to 200 GHz using different full-wave (FW) simulation tools, yielding good correlation. Scattering phenomena play a more significant role than losses in the behavior of these arrays. Considerations essential for improved interconnect performance in next-generation highspeed communication systems, increasing bandwidth by 20 GHz, are outlined. Coax vias and interstitial ground vias improving transmission are investigated.enhigh-speedmodelingprinted circuit boardssignal integrityvia arrayTechnology::621: Applied Physics::621.3: Electrical Engineering, Electronic EngineeringConference Paper10.1109/SPI68887.2026.11594650