Electrical and thermomechanical evaluation of 2nd-level-interconnects for LTCC modules

Baras, TorbenTorbenBarasCorrales Hernández, MariaMariaCorrales HernándezJacob, ArneArneJacob2021-11-222021-11-222006Proceedings of the 39th International Symposium on Microelectronics (IMAPS), San Diego, California, USA. - Pp. 1142-1147 (2006)http://hdl.handle.net/11420/11021enTechnikIngenieurwissenschaftenElectrical and thermomechanical evaluation of 2nd-level-interconnects for LTCC modulesConference PaperOther