Scharff, KatharinaKatharinaScharffTorun, Hakki M.Hakki M.TorunYang, ChengChengYangSwaminathan, MadhavanMadhavanSwaminathanSchuster, ChristianChristianSchuster2020-12-112020-12-112020-09-23EMC Europe 2020http://hdl.handle.net/11420/8205Signal integrity is becoming an important aspect of EMC engineering of digital systems. The signal integrity performance of printed circuit board links is influenced by a large number of design choices. Bayesian Optimization is a method that can optimize a large number of parameters in a reasonable amount of time. In this work it is shown that Bayesian Optimization can be used for the optimization of interconnect models with respect to their transmission and crosstalk performance. The first example is the optimization of the transmission of a single via. The second example is a 10 by 10 via array where the optimization includes transmission and crosstalk. The results obtained with the Bayesian Optimization are compared with the results of a Genetic Algorithm and with design guidelines derived from a physical perspective.enConference Paper10.1109/EMCEUROPE48519.2020.9245762Other