Frank, MartinMartinFrankReissland, TorstenTorstenReisslandLurz, FabianFabianLurzVoelkel, MatthiasMatthiasVoelkelLambrecht, FranziskaFranziskaLambrechtKiefl, StefanStefanKieflGhesquiere, PolPolGhesquiereJalli Ng, HermanHermanJalli NgKissinger, DietmarDietmarKissingerWeigel, RobertRobertWeigelKölpin, AlexanderAlexanderKölpin2020-06-302020-06-302018-12-01IEEE Transactions on Microwave Theory and Techniques 12 (66): 8515104 (2018-12-01)http://hdl.handle.net/11420/6510This paper suggests the usage of an optimized structure of the embedded wafer-level ball grid array technology for millimeter-wave antennas-in-package. Multiple antenna arrays in a second redistribution layer have been designed, evaluated, and integrated with different transceivers to form very compact sensor packages for 61- and 122-GHz radar applications. The resulting packages contain a complete radar front end while featuring dimensions of 8 mm × 8 mm. The packages are easy to assemble and replaceable. Theoretical considerations, numerical results, and measurements have been carried out for the single components. For the verification of the sensor packages, a system demonstrator was developed, and measurements have been performed in continuous-wave mode. At both frequencies, promising system performance regarding range and distance errors could be confirmed without the usage of complex processing and calibration algorithms.en0018-948020181251565168Antenna arraysembedded wafer-level ball grid array (eWLB)microwave sensorsmillimeter-wave radarpackagingradar systemsJournal Article10.1109/TMTT.2018.2873368Other