Functional Via-Structures in Ceramic Multilayered Substrates
„Low Temperature Cofired Ceramics“ (LTCC) is a technology that distinguishes itself from conventional technologies used for „Printed Circuit Boards“ (PCB) by means of a high permittivity, low dielectric losses and less manufacturing tolerances. LTCC technology is therefore especially useful for applications in microwave engineering and can allow for a high integration density of microwave devices and circuits due to the mechanical strength and high thermal conductivity of the material. To this end, via-structures (as opposed to microstrips) are supposed to be employed as functional elements for the design of filters, couplers and matching networks. That this can be an alternative to conventional methods using microstrips has already been shown and successfully applied for PCBs up to 20 GHz. This work is now to be extended to 70 GHz for use in LTCC multilayerd substrates. In doing so, established modeling techniques require to be adjusted and extended. Furthermore, appropriate testing structures will be designed as well as characterized using suitable measurement techniques.