Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards

Projekt Titel

Startdatum

October 1, 2013

Enddatum

October 15, 2018

Award URL

https://www.tet.tuhh.de/en/research/signal-and-power-integrity-si-pi/

Institut

Theoretische Elektrotechnik E-18

Projektleitung

Schuster, Christian

Mitarbeitende

Reuschel, Torsten

Increasing data rates and reduced design margins oppose a detailed consideration of the diverse aspects of high-speed digital links, such as the passive channel, equalization, and coding. This work offers novel methods for the computationally efficient design and validation of links. A combined system perspective is established based on predominant physical parameters of the interconnect and key parameters of equalizer design. This enables a systematic prediction of design constraints and is accompanied by a study of advanced uncertainty quantification methods for pre- and post-layout design.

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