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Projekt Titel
Development, Validation and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
Startdatum
November 1, 2006
Enddatum
December 31, 2010
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Institut
Projektleitung
Mitarbeitende
This project deals with the efficient modeling and simulation of multilayer substrates in high-speed electronic systems.
Semi-analytical models for vias and traces in packages and printed circuit boards are proposed and incorporated into a framework for automatic simulation of multilayer structures. The models are validated with general-purpose numerical methods for electromagnetic simulation and measurements, using typical configurations such as differential and single-ended links. Application scenarios of realistic complexity for signal integrity, power integrity, and electromagnetic compatibility are evaluated and the co-simulation of these three domains is explored.
TUHH Universitätsbibliothek. TUBDok Link: http://doku.b.tu-harburg.de/volltexte/2011/1091
Semi-analytical models for vias and traces in packages and printed circuit boards are proposed and incorporated into a framework for automatic simulation of multilayer structures. The models are validated with general-purpose numerical methods for electromagnetic simulation and measurements, using typical configurations such as differential and single-ended links. Application scenarios of realistic complexity for signal integrity, power integrity, and electromagnetic compatibility are evaluated and the co-simulation of these three domains is explored.
TUHH Universitätsbibliothek. TUBDok Link: http://doku.b.tu-harburg.de/volltexte/2011/1091