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Optical Profilometer Dataset for Diced Surfaces Obtained with Wafer Dicing Machine at Varying Feed Velocities
Citation Link: https://doi.org/10.15480/882.15763
Type
Measurement and Test Data
Version
Version 1
Date Issued
2026-01-29
Data Collector
Language
English
Abstract
Fused silica wafers (1mm thickness) were diced with a wafer dicing machine (Disco DAD3350) at different feed velocities to analyze the impact on the surface roughness. The surface roughness was measured with an optical profilometer (Keyence VK-X3000) in white light interferometer mode. Raw data from the interferometer measurements and a README file are included in this dataset.
Subjects
Wafer Dicing
Optical Profilometer
Surface Roughness
DDC Class
620.1: Engineering Mechanics and Materials Science
More Funding Information
This data set was generated as part of the DFG-funded project CRC 1615: SMART Reactors for Future Process Engineering (DFG Project Number: 503850735).
No Thumbnail Available
Name
data_raw.zip
Size
24.28 MB
Format
ZIP
No Thumbnail Available
Name
README.txt
Size
3.47 KB
Format
Text
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Name
README.pdf
Size
200.26 KB
Format
Adobe PDF