Optical Profilometer Dataset for Diced Surfaces Obtained with Wafer Dicing Machine at Varying Feed Velocities
Citation Link: https://doi.org/10.15480/882.15763
Type
Measurement and Test Data
Version
Version 1
Date Issued
2026-01-29
Data Collector
Language
English
TORE-DOI
Abstract
Fused silica wafers (1mm thickness) were diced with a wafer dicing machine (Disco DAD3350) at different feed velocities to analyze the impact on the surface roughness. The surface roughness was measured with an optical profilometer (Keyence VK-X3000) in white light interferometer mode. Raw data from the interferometer measurements and a README file are included in this dataset.
Subjects
Wafer Dicing
Optical Profilometer
Surface Roughness
DDC Class
620.1: Engineering Mechanics and Materials Science
More Funding Information
This data set was generated as part of the DFG-funded project CRC 1615: SMART Reactors for Future Process Engineering (DFG Project Number: 503850735).