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  4. Automatic wafer probing of photonic integrated circuits with thermal tuning and permanent trimming functions
 
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Automatic wafer probing of photonic integrated circuits with thermal tuning and permanent trimming functions

Publikationstyp
Conference Paper
Date Issued
2023-10-23
Sprache
English
Author(s)
Lipka, Timo  
Mikrosystemtechnik E-7  
Vermeer, Matthias  
Mikrosystemtechnik E-7  
Rennpferdt, Lukas  
Mikrosystemtechnik E-7  
Alhareeb, Nadeem K.
Mikrosystemtechnik E-7  
Gomberg, Ilja  
Mikrosystemtechnik E-7  
Trieu, Hoc Khiem  
Mikrosystemtechnik E-7  
TORE-URI
https://hdl.handle.net/11420/46377
Citation
Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023. - Berlin, 2023.
Contribution to Conference
10. MikroSystemTechnik Kongress 2023  
Scopus ID
2-s2.0-85196915088
Publisher
VDE Verlag
ISBN
978-3-8007-6203-3
978-3-8007-6204-0
The development of silicon photonic circuits brings new challenges in quality assurance and testing, such as characterizing and measuring large quantities of photonic components on a wafer. Here we report about a custom wafer prober for photonic integrated circuits with thermal tuning and permanent trimming functions. Probing experiments were successfully performed with spectral transmission measurements of crystalline and amorphous silicon photonic components. Active thermal tuning of microring resonances were verified and tested with integrated heaters using an electrical probe card whereas permanent modifications were achieved with a trim laser at visible wavelength.
DDC Class
600: Technology
621: Applied Physics
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