A novel, W-band microwave based contactless test method for mechanical sensitivity analysis of MEMS

Publikationstyp
Conference Paper
Date Issued
2013-12-01
Sprache
English
Author(s)
Oesterle, Florian  
Vinci, Gabor  
Weigel, Robert  
Kölpin, Alexander  orcid-logo
TORE-URI
http://hdl.handle.net/11420/6827
Journal
IEEE MTT-S International Microwave Symposium digest  
Article Number
6697701
Citation
IEEE MTT-S International Microwave Symposium Digest: 6697701 (2013-12-01)
Contribution to Conference
IEEE MTT-S International Microwave Symposium, IMS 2013  
Publisher DOI
10.1109/MWSYM.2013.6697701
The desired functionality of Micro Electro Mechanical Systems (MEMS) suffers from the influence on the nominal stress level of the mechanical components, e.g. by deviating manufacturing process parameters. Therefore, appropriate methods for testing mechanical parameters of MEMS is a key issue. The focus is on contactless techniques, short measurement time, accurate repeatability, and inline integration in manufacturing environments for mass production. Depending on the configuration of the device components, a couple of methods, such as optical interferometry, electrical impedance measurements and system level sensitivity tests are nowadays in use. This article presents a novel method for contactless testing of mechanical sensitivity of MEMS devices based on W-band microwave interferometry. Results of measurements at 90GHz are shown. The excellent detection of the test parameter verifies the feasibility and enormous potential of this proposed method.
Subjects
Contactless Testing
Deflection Measurements
Mechanical Sensitivity
Microelectromechanical Systems
Microphones
Microwave Inter-ferometry
W-band