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  4. Partial image expansion applied to real near-field measurement data modeling
 
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Partial image expansion applied to real near-field measurement data modeling

Publikationstyp
Conference Paper
Date Issued
2024
Sprache
English
Author(s)
Monopoli, Tomas  
Wu, Xinglong  
Yang, Cheng  
Theoretische Elektrotechnik E-18  
Pignari, Sergio Amedeo  
Grassi, Flavia  
Wolf, Johannes  
TORE-URI
https://hdl.handle.net/11420/48654
Start Page
138
End Page
141
Citation
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity and International Symposium on Electromagnetic Compatibility, EMC Japan & APEMC Okinawa 2024
Contribution to Conference
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity and International Symposium on Electromagnetic Compatibility, EMC Japan & APEMC Okinawa 2024  
Publisher DOI
10.23919/EMCJapan/APEMCOkinaw58965.2024.10585137
Publisher Link
https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10585137
Scopus ID
2-s2.0-85199473586
Publisher
IEEE
ISBN
9784885523472
This work uses the partial image expansion method to build an infinitesimal dipole model (IDM) of a physical Printed Circuit Board (PCB) starting from the measured near-fields. Using partial image expansion allows to include the substrate directly in the equivalent model, that is composed of PEC plane, substrate and dipole sources. The addition of the dielectric increases the model versatility allowing for a wider range of simulations to be run (e.g. closed environments, multiple boards, etc.). In this paper, the radiation model of the physical device is obtained and imported in a commercial full-wave solver (HFSS). The simulation results are finally compared with the original measurements, experimentally validating the accuracy of an IDM built using partial image expansion.
Subjects
Infinitesimal dipole model
Method of Images
Near-field scanning
Printed circuit boards (PCB)
Radiated fields
DDC Class
621.3: Electrical Engineering, Electronic Engineering
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