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  4. Photonic integrated circuit components based on amorphous silicon-on-insulator technology
 
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Photonic integrated circuit components based on amorphous silicon-on-insulator technology

Publikationstyp
Journal Article
Date Issued
2016-05-11
Sprache
English
Author(s)
Lipka, Timo  
Moldenhauer, Lennart  
Müller, Jörg  
Trieu, Hoc Khiem  
Institut
Mikrosystemtechnik E-7  
TORE-URI
http://hdl.handle.net/11420/5516
Journal
Photonics research  
Volume
4
Issue
3
Start Page
126
End Page
134
Citation
Photonics Research 3 (4): 126-134 (2016-06-01)
Publisher DOI
10.1364/PRJ.4.000126
Scopus ID
2-s2.0-84971520158
Publisher
OSA
We present integrated-optic building blocks and functional photonic devices based on amorphous silicon-on-insulator technology. Efficient deep-etched fiber-to-chip grating couplers, low-loss single-mode photonic wire waveguides, and compact power splitters are presented. Based on the sub-μm photonic wires, 2 × 2 Mach-Zehnder interferometers and add/drop microring resonators (MRRs) with low device footprints and high finesse up to 200 were realized and studied. Compact polarization rotators and splitters with ≥10 dB polarization extinction ratio were fabricated for the polarization management on-chip. The tuning and trimming capabilities of the material platform are demonstrated with efficient microheaters and a permanent device trimming method, which enabled the realization of energy-efficient photonic circuits. Wavelength multiplexers in the form of cascaded filter banks and 4 × 4 routers based on MRR switches are presented. Fabrication imperfections were analyzed and permanently corrected by an accurate laser-trimming method, thus enabling eight-channel multiplexers with record low metrics of sub-mW static power consumption and ≤1°C temperature overhead. The high quality of the functional devices, the high tuning efficiency, and the excellent trimming capabilities demonstrate the potential to realize low-cost, densely integrated, and ultralow-power 3D-stacked photonic circuits on top of CMOS microelectronics.
DDC Class
600: Technik
More Funding Information
Supported by DFG and TUHH in the funding programme Open Access Publishing.
TUHH
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