A novel package approach for multichip modules based on anisotropic conductive adhesives

Publikationstyp
Conference Paper
Publikationsdatum
2005-10
Sprache
English
Author
Heyen, Johann 
Jacob, Arne F. 
Institut
Arbeitsbereich Elektrotechnik III, Hochfrequenztechnik 2-11(H) 
TORE-URI
http://hdl.handle.net/11420/11172
Volume
3
Start Page
1499
End Page
1502
Article Number
1610235
Citation
35th European Microwave Conference 2005 - Conference Proceedings 3 (): 1610235 1499-1502 (2005)
Contribution to Conference
35th European Microwave Conference (EuMC) 2005 
Publisher DOI
10.1109/EUMC.2005.1610235
Publisher Link
https://tore.tuhh.de/handle/11420/11172
Scopus ID
2-s2.0-33847095581
Publisher
Horizon House Publ.
In this paper anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabilities is presented.
DDC Class
600: Technik
620: Ingenieurwissenschaften