Automated Generation and Correlation of Physics-Based Via Models with Full-Wave Simulation for an SI/PI Database

Publikationstyp
Conference Paper
Date Issued
2023-10
Sprache
English
Author(s)
Hillebrecht, Til 
Theoretische Elektrotechnik E-18  
Alfert, Johannes
Reuschel, Torsten  
University of New Brunswick
Schuster, Christian  
Theoretische Elektrotechnik E-18  
TORE-URI
https://hdl.handle.net/11420/44721
Citation
IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS 2023)
Contribution to Conference
IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2023  
Publisher DOI
10.1109/epeps58208.2023.10314907
Publisher
IEEE
DDC Class
620: Engineering