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  4. Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards
 
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Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards

Publikationstyp
Bachelor Thesis
Date Issued
2019-02-01
Sprache
English
Author(s)
Reuschel, Torsten  
Advisor
Schuster, Christian  
Examination Date
2018-10-15
Institut
Theoretische Elektrotechnik E-18  
TORE-URI
http://hdl.handle.net/11420/4190
Citation
Technische Universität Hamburg (2019)
DDC Class
000: Allgemeines, Wissenschaft
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