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Novel multiport probing fixture for high frequency measurements in dense via arrays
Publikationstyp
Conference Paper
Date Issued
2011
Sprache
English
Institut
Start Page
1
End Page
4
Article Number
5972758
Citation
IEEE MTT-S International Microwave Symposium Digest (): 5972758 1-4 (2011)
Contribution to Conference
Publisher DOI
Scopus ID
Publisher
IEEE
In this paper the authors present a novel multiport probing fixture for high frequency measurements of dense via arrays. The probing fixture consists of a 36 mm by 36 mm multilayer printed circuit board plugged into an LGA socket clamped down to the device under test using custom hardware. The test signal is launched from top surface mounted coaxial connectors and fanned in with striplines to a 1 mm via pitch on the bottom side. Custom calibration substrates are used to deembed the probing fixture from measurements by applying multiport deembedding techniques. The effect of contact pressure on obtaining reproducible measurements is investigated.
Subjects
multiport measurements
printed circuit board
probing fixture
two-tier calibration
via arrays
VNA
DDC Class
600: Technik
620: Ingenieurwissenschaften