Novel multiport probing fixture for high frequency measurements in dense via arrays

Enthalten in
IEEE MTT-S International Microwave Symposium digest 
Start Page
1
End Page
4
Article Number
5972758
Citation
IEEE MTT-S International Microwave Symposium Digest (): 5972758 1-4 (2011)
Contribution to Conference
IEEE MTT-S International Microwave Symposium 2011 
Publisher DOI
10.1109/MWSYM.2011.5972758
Scopus ID
2-s2.0-80052315316
Publisher
IEEE
In this paper the authors present a novel multiport probing fixture for high frequency measurements of dense via arrays. The probing fixture consists of a 36 mm by 36 mm multilayer printed circuit board plugged into an LGA socket clamped down to the device under test using custom hardware. The test signal is launched from top surface mounted coaxial connectors and fanned in with striplines to a 1 mm via pitch on the bottom side. Custom calibration substrates are used to deembed the probing fixture from measurements by applying multiport deembedding techniques. The effect of contact pressure on obtaining reproducible measurements is investigated. © 2011 IEEE.
Schlagworte
multiport measurements
printed circuit board
probing fixture
two-tier calibration
via arrays
VNA
DDC Class
600: Technik
620: Ingenieurwissenschaften