Understanding the copper underpotential deposition process at strained gold surface

Publikationstyp
Journal Article
Date Issued
2017-08-01
Sprache
English
Author(s)
Yang, Mingzhu  
Zhang, Haixia  
Deng, Qibo  
Institut
Werkstoffphysik und -technologie M-22  
TORE-URI
http://hdl.handle.net/11420/3899
Journal
Electrochemistry communications  
Volume
82
Start Page
125
End Page
128
Citation
Electrochemistry Communications (82): 125-128 (2017-09-01)
Publisher DOI
10.1016/j.elecom.2017.07.029
Scopus ID
2-s2.0-85026918289
Publisher
Elsevier Science
Copper underpotential deposition (UPD) on a gold surface is investigated by cyclic voltammetry coupled with in situ cyclic strain to understand the strain-modulated electrodeposition. Our work emphasizes quantification of an electrocapillary coupling coefficient ς, which relates the response of Cu electrodeposition potential, E, to applied strain, ε. The different responses to the strain are observed at two Cu UPD stages. The data indicate that tensile strain could enhance the formation of a Cu monolayer on the Au surface. The typical electrodeposition process could be modulated by an external mechanical strain.
Subjects
Copper electrodeposition
Electrocapillary coupling
Metal-electrolyte interface
Strain modulation
DDC Class
530: Physik
600: Technik
More Funding Information
Supported by National Natural Science Foundation of China (No. 11602171), and partially funded by Deutsche Forschungsgemeinschaft, grant WE1424/16-1.