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On-orbit verification of an LTCC double flip-chip packaging concept in an S-/K-band satellite transponder
Publikationstyp
Conference Paper
Date Issued
2013
Sprache
English
Institut
TORE-URI
Article Number
6697451
Citation
IEEE MTT-S International Microwave Symposium digest (IMS), 2013 : 2 - 7 June 2013, Seattle, WA, USA ; [held as part of Microwave Week 2013]. - Piscataway, NJ : IEEE, 2013. - Art.-Nr. 6697451
Contribution to Conference
Publisher DOI
Scopus ID
Publisher
IEEE
The on-orbit verification of a double flip-chip packaging concept using low temperature co-fired ceramic (LTCC) technology is presented. Modules based on this concept were designed, fabricated, and assembled as a transparent transponder system. This system is an experimental payload on a small scientific satellite which was launched on July 22, 2012. The transponder uses S-band signaling for the up- and downlink and internally converts the signal to the K-band. The K-band stage employs multiple redundant LTCC modules to improve robustness against failure. The success of the mission is demonstrated by the presented results of a live communication link between the ground station and the experimental payload. This demonstrates technology readiness of the LTCC modules and the underlying packaging concept.
DDC Class
600: Technik
620: Ingenieurwissenschaften