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Recent developments of via and return current path modeling
Publikationstyp
Conference Paper
Date Issued
2011
Sprache
English
Institut
Start Page
1376
End Page
1379
Article Number
6046278
Citation
Proceedings - 2011 International Conference on Electromagnetics in Advanced Applications, ICEAA'11 (): 6046278 1376-1379 (2011)
Contribution to Conference
Publisher DOI
Scopus ID
Publisher
IEEE
This paper reviews solutions for the modeling of vias in printed circuit boards. The focus is on two approaches: multiple scattering methods and equivalent circuit models. For each approach, the general concept is described, followed by examples of recently improved or newly developed implementations. The applicability to several kinds of via modeling tasks is summarized. Finally, a closer look is taken at the different ways of return current path modeling in the two approaches. The analysis also illustrates the frequency-dependent behavior of the return current. © 2011 IEEE.
DDC Class
600: Technik
620: Ingenieurwissenschaften